Official distributor Siemens
SIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Zone 21 and 22 (dust). Size (WxHxD): 950x450x230, for max. 25 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 57x M20 (6-13 mm) for signals in 3 rows, version in plastic blue. Ambient operating temperature -20 °C...+70 °C
under the orderSIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Cat. 2 Zone 21 and 22 (dust). Size (WxHxD): 950x450x230, for max. 25 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 66x M16 (4-9 mm) for signals in 3 rows, version in plastic blue. Ambient operating temperature -20 °C...+70 °C
under the orderSIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Cat. 3 Zone 21 and 22 (dust). Size (WxHxD): 950x450x230, for max. 25 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 66x M16 (4-9 mm) for signals in 3 rows, plastic version. Ambient operating temperature -20 °C...+70 °C
under the orderSIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Cat. 3 Zone 21 and 22 (dust). Size (WxHxD): 650x450x230, for max. 15 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 60x M20 (6-13 mm) for signals in 5 rows, version in plastic blue. Ambient operating temperature -20 °C...+70 °C
under the orderSIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Cat. 3 Zone 21 and 22 (dust). Size (WxHxD): 650x450x230, for max. 15 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 65x M16 (4-9 mm) for signals in 5 rows, version in plastic blue. Ambient operating temperature -20 °C...+70 °C
under the orderSIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Cat. 3 Zone 21 and 22 (dust). Size (WxHxD): 650x450x230, for max. 15 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 65x M16 (4-9 mm) for signals in 5 rows, plastic version. Ambient operating temperature -20 °C...+70 °C
under the orderSIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Cat. 3 Zone 21 and 22 (dust). Size (WxHxD): 650x450x230, for max. 15 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 36x M20 (6-13 mm) for signals in 3 rows, version in plastic blue. Ambient operating temperature -20 °C...+70 °C
under the orderSIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Cat. 2 Zone 21 and 22 (dust). Size (WxHxD): 650x450x230, for max. 15 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 39x M16 (4-9 mm) for signals in 3 rows, version in plastic blue. Ambient operating temperature -20 °C...+70 °C
under the orderSIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Cat. 3 Zone 21 and 22 (dust). Size (WxHxD): 650x450x230, for max. 15 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 39x M16 (4-9 mm) for signals in 3 rows, plastic version. Ambient operating temperature -20 °C...+70 °C
under the orderSIEMENS Ex-device made of
Ex-device made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. Device group II Cat. 2 Zone 1 and 2 (gas). Size (WxHxD): 950x450x230, for max. 25 I/O modules. Cable glands: 2x M32 power supply, 4x M20 bus cables and 95x M20 (6-13 mm) for signals in 5 rows, version in plastic blue. Ambient operating temperature -20 °C...+70 °C
under the order
